Believe it or not i've done alot of xboxes...ALOT and all with no problmes except:
i have these 2 1.0's that when removing the solder (i always do pin header as i hate the wire method) from the holes i may have damaged some of the contacts.
I get 3 reboots then FRAG..if i turn the chip off it boots up nomally so i know my DO is good. I've checked VERY closly on both and neither have any bridges of splahes... my question is this:
Are there alternative points on the MOBO that i can solder to (via the wire install i assume or just wire solder to a single pin header) that would bypass this apparently butched LPC area. on one of them im pretty sure that its only 2 of the holes that may be fuxored...
i've looked everywhere for alternate points diagrams but have come up with nothing except alternate 1.6 spots (these are both 1.0's)
'thanks
i have these 2 1.0's that when removing the solder (i always do pin header as i hate the wire method) from the holes i may have damaged some of the contacts.
I get 3 reboots then FRAG..if i turn the chip off it boots up nomally so i know my DO is good. I've checked VERY closly on both and neither have any bridges of splahes... my question is this:
Are there alternative points on the MOBO that i can solder to (via the wire install i assume or just wire solder to a single pin header) that would bypass this apparently butched LPC area. on one of them im pretty sure that its only 2 of the holes that may be fuxored...
i've looked everywhere for alternate points diagrams but have come up with nothing except alternate 1.6 spots (these are both 1.0's)
'thanks