My D0 was soldered under an electronics microscope & has been checked MULTIPLE times with a voltmeter. It is positively connected to the chip. Ditto for gray and white wires on points 13 & 14 which read the proper 3.3v. However, I get the same problem as lots of others. Chip lights up, but does not boot. MS dash comes up every time. However, if I manually jumper a wire from a ground point to the D0 point, the chip boots to X3CL. With this "permanent" ground in place, I can *never* get to the MS dashboard as the boot process is automatically hijacked every time.
My pin 15 doesn't have anything connected to it, but I do get the proper 3.3v from pin 9. The blue led for 3.3v on the chip itself lights up properly. Is there any other reason to bond pins 9 & 15, or is it recommended ONLY if you are having trouble getting the 3.3v LED to light up? In other words, would bonding these 2 points together help with the boot hijack even though the chip gets the proper 3.3v as it's currently wired?
Does anyone understand (from a purely technical standpoint) how the chip grounds the D0 out to "hijack" the boot process? Is there some sort of switching process that occurs inside the chip itself? I have tested everything else I can possibly think of.
~Vol
My pin 15 doesn't have anything connected to it, but I do get the proper 3.3v from pin 9. The blue led for 3.3v on the chip itself lights up properly. Is there any other reason to bond pins 9 & 15, or is it recommended ONLY if you are having trouble getting the 3.3v LED to light up? In other words, would bonding these 2 points together help with the boot hijack even though the chip gets the proper 3.3v as it's currently wired?
Does anyone understand (from a purely technical standpoint) how the chip grounds the D0 out to "hijack" the boot process? Is there some sort of switching process that occurs inside the chip itself? I have tested everything else I can possibly think of.
~Vol