I can see micro fracturing the chip or even straight up visibly cracking it or even not making sure there is even pressure for heat distrobution and causing it RROD again. Removing the stock X-clamp removes the unnecessary amounts of pressure that it stresses on the chip itself. they also provided little amount of thermal paste, that may not be the case for everyones xbox. And we all know what adding better thermal paste does, not need to explain that.Please don't listen to people who tell you to replace the x-clamps with bolts that screw down the heatsinks and create uneven pressure on the chips. It only damages the chips in the long run and decrease the likely hood of a good professional fix later on. Sure, the xbox can still RROD on you even if you keep it cool. It's the lead-free solder that after X number of times of heating up and cooling down will crack and break a connection which will cause your unit to fail. .