Jtag won't start

[lesta_smsc]

What? You clear BSoD issues on your PC by getting it to overheat?

wow.

Hmmm no need for sarcasm when you completely missed the point of my response. If you knew any better BSoD isn't due to overheating lol.

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[Martin C]

Hmmm no need for sarcasm when you completely missed the point of my response. If you knew any better BSoD isn't due to overheating lol.

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Neither is 3 red lights. I'm glad we got that out of the way.

 

[lesta_smsc]

Neither is 3 red lights. I'm glad we got that out of the way.

Er... poor solder joint under the relevant chip would not have occurred if it dis NOT overheat. Anyways enough arguing over something which doesn't really affect me lol.

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[jsinger47]

Er... poor solder joint under the relevant chip would not have occurred if it dis NOT overheat.

False.

 

[lesta_smsc]

False.

You're saying xbox common fault is not overheating and poor cooling mechanism?

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[Martin C]

You're saying xbox common fault is not overheating and poor cooling mechanism?

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That's 100% correct.

 

[Taijigamer2]

TBF thermal flexing is not the same as overheating. If the console was overheating it would shut off as per the internal temp limits.

 

[jsinger47]

TBF thermal flexing is not the same as overheating. If the console was overheating it would shut off as per the internal temp limits.

Exactly

 

[lesta_smsc]

TBF thermal flexing is not the same as overheating. If the console was overheating it would shut off as per the internal temp limits.

Point taken... explain how a reflow addresses this flexing?

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[Martin C]

Point taken... explain how a reflow addresses this flexing?

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flexing/thermal stress causes the BGA solder to crack and separate over time.

A reflow with good quality flux allows the solder balls to reseat and go back to their normal form.

 

[Antalpromille]

Point taken... explain how a reflow addresses this flexing?

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A reflow doesnt adress the flexing but re-melt the solder and make the cracked solder joints to join again. This doesnt always work or may fail again and thats why you would prefer reballing instead.

Edit: Martin beat me to it.

 

[lesta_smsc]

flexing/thermal stress causes the BGA solder to crack and separate over time.

A reflow with good quality flux allows the solder balls to reseat and go back to their normal form.

And the problem arises because? ... the cooling system is inefficient. Hence why unless it is reballed with lead solder or one with a higher melting point than is already on xbox it will fail again. Now just to say the method I advised does enough in most instances to address a good enough connection for the xbox to boot. Therefore provided the cooling is better subsequently it is less likely to RROD again.

Anyways seriously this is becoming a pointless topic.

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[jsinger47]

And the problem arises because? ... the cooling system is inefficient. Hence why unless it is reballed with lead solder or one with a higher melting point than is already on xbox it will fail again.

Lol. Lead solder has a LOWER melting point than non leaded.

Sounds like you've been watching too many YouTube videos made by 12 year old children.


In the case of a spelling error, I blame Tapatalk.

 

[Taijigamer2]

Unfortunately deliberately overheating the console does not get even close to reflow temp so all u get is a temporary oxide bridge formed, a bandaid. Cooling or no cooling after a few power cycles those bonds will break again. IMHO it doesnt matter whether u use lead or pb-free solder to reball the chips (M$ developed it to use pb-free) its the thermal flexing that needs to be addressed. A professional reball, adequate cooling (no need to overkill with 12v mods and heatsinks in all directions) and a modified chassis should be enough to give the box a new lease of life, just my 2 cents. Sorry to flog a dead horse but its interesting the range of opinion on the subject.

 

[lesta_smsc]

Unfortunately deliberately overheating the console does not get even close to reflow temp so all u get is a temporary oxide bridge formed, a bandaid. Cooling or no cooling after a few power cycles those bonds will break again. IMHO it doesnt matter whether u use lead or pb-free solder to reball the chips (M$ developed it to use pb-free) its the thermal flexing that needs to be addressed. A professional reball, adequate cooling (no need to overkill with 12v mods and heatsinks in all directions) and a modified chassis should be enough to give the box a new lease of life, just my 2 cents. Sorry to flog a dead horse but its interesting the range of opinion on the subject.

Hear hear... end of discussion. Unless the others are too bored and want to continue. Lol

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[Martin C]

You're not going to stop thermal cycles of solder from happening, regardless of how many fans you stick on there. You'll reduce the temperature by 20% maximum, but the GPU/CPU will still go through thermal cycles. The problem with the 360 and PS3 is the thermal cycles combined with lead-free solder. Look up 'tin whiskers' for more information.

I'm not talking about this in a theoretical sense. I've reballed enough 360 consoles which had additional cooling added from day one to know this as a fact.

 

[lesta_smsc]

You're not going to stop thermal cycles of solder from happening, regardless of how many fans you stick on there. You'll reduce the temperature by 20% maximum, but the GPU/CPU will still go through thermal cycles. The problem with the 360 and PS3 is the thermal cycles combined with lead-free solder. Look up 'tin whiskers' for more information.

I'm not talking about this in a theoretical sense. I've reballed enough 360 consoles which had additional cooling added from day one to know this as a fact.

Thank you. And sorry lol

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