Pressure on chip

zombie4000

Full Member
Apr 5, 2006
50
0
I turn my xbox on and it frags. I reseat the chip and it frags again. I put pressure on the back side of the chip and it boots fine. What is going on? I dont mind doing it but taking the case off the xbox and all the jazz gets annoying
 

Big_Whoopin

VIP Member
Jan 29, 2004
811
0
SE Pennsylvania, USA
A "dry" or "cold" solder joint is when the points being soldered did not heat up enough for the solder to properly flow between them and make good contact. I know there are at least two points of the LPC that tend to heat up more slowly when soldering, they probably have beefy traces that are acting as a heat sink. Don't recall which pins they are tho. It gets mentioned that solid solder joints look like shiny little volcanoes. The solder tapers down from the top (bottom?) of the pin to the LPC hole solder ring... the *entire* ring, all the way around. If your solder work looks like a blob or ball it is possible that it doesn't have a good connection. Use of solder flux helps to draw the solder in between points as well.

-Whoopin'
 

zombie4000

Full Member
Apr 5, 2006
50
0
Ok well this has changed. I don't need to put pressure on the chip. The chip when it is on the pin header is sitting like this - . I need to tilt the chip to sit like this \ . Its the weirdest thing. Im guessing its not making a good connection when it is sitting perfect. Anyone ever hear of this problem.